Design
Taiyo Kogyo's Design Team can meet all of your demands, from what parts should be used, what current handling capacity is needed, to parts mounting process, with our unique technology, utilizing our abundant knowledge and experiences. We can also realize short delivery lead time and low cost.
- SI Simulation EMC Simulation
- Proposal of layer structure considering High Current, Thick Copper and Impedance control
- Countermeasure for heat generating device (Heat Dissipation Countermeasures / Current Capacity)
- Assembly problem unique to Thick Copper PCB (Solderability problem etc.) We will offer various solutions.
Available copper foil thickness
18 / 35 / 70 / 105 / 140 / 175 / 210 / 240 / 300 / 400 / 500 / 600 / 800 / 1000 / 1200 / 1600 / 2000μm
0.5 / 1 / 2 / 3 / 4 / 5 / 6 / 6.8 / 8.6 / 11.4 / 14.3 / 17 / 22.8 / 28.5 / 34.2 / 45.7 / 57.1oz
We have measured data for the relationship between trace width(Conductor cross-section) of various copper foil thickness and current handling capacity of conductor and temperature rise with actual boards.
Measurement Data Details
| Copper foil thickness | 18 – 500um (0.5 – 14.3oz) |
|---|---|
| Trace width of various copper foil thickness | 0.3 – 60.0mm |
| Temperature rise | Δt=10°:C-100°C |
| Allowable current per 1 Through Hole | Finished diameter φ0.3 – 5.5mm |
Attention!!
Even if you use 10 Through Holes of 1A handling per hole, you can't handle 10A current.
We have data for required number of Through Holes to handle necessary current value.
SI / EMI Simulation
Reducing frequency of trial test run at the time of development developing time
- Instant operation, Reducing frequency of trial test run (It is feasible to shorten development time drastically)
- Reduction of development cost (Reducing process number of Design, PCB, NRE, Mounting, and Evaluation)
Conventional artwork design can not predict PCB’s performance before being produced?
Quality of Signal Waveform(Overshoot, Undershoot, Ringing)?
Stabilization of Power Plane? Reflection of Noise?
Out of specification limit?
Cannot pass VCCI?
Do you have any problems about cost and delivery lead time because of repeated trial test run and evaluation?
| SI Analysis | Reflection / Overshoot / Undershoot / Transmission Delay Analysis / Crosstalk / Timing / Analysis of noise from adjacent signal and noise to adjacent signal / Simultaneous Switching / Impedance Control etc… |
|---|---|
| EMI Analysis | Wiring length check / Number of via check / filter check / Board edge check / Radiation electric field / GV plane crossover check / Return path discontinuous check / Plane circumference check / SG pattern check / Differential signal check / SG pattern via space check / Decoupling capacitor check etc… |
