Capabilities
| Standard PCB | High Current PCB | |
|---|---|---|
| Material |
FR-4 (Glass Epoxy Copper Clad Laminate) Halogen Free Material FR-5 Equivalent Material (High Tg Glass Epoxy Copper Clad Laminate) CEM-3 (Glass Composite Material) |
FR-4 (Glass Epoxy Copper Clad Laminate) Halogen Free Material |
| Number of Layers | 2 Layers - 16Layers |
105μm-210μm(3oz - 6oz): 2 Layers - 16Layers 300μm-500μm(8.6oz - 14.3oz): 2 Layers - 6Layers |
| Copper foil thickness | 18μm - 70μm (0.5oz - 2oz) |
Thick Copper PCB: 105μm - 500μm (3oz - 14.3oz) Bus Bar Embedded PCB: 500m - 2000m (14.3oz - 57oz) |
| Minimum Drill Hole Diameter / Minimum Land Diameter |
18μm-35μm(0.5oz - 1oz)：Drill=0.20mm(0.008")/Land=Drill+0.30mm(0.012") 70μm(2oz)：Drill=0.30mm(0.012")/Land=Drill+0.40mm(0.016") |
105μm-210μm(3oz - 6oz)：Drill=0.50mm(0.020") 300μm-500μm(8.6oz - 14.3oz)：Drill=0.60mm(0.024") |
| Minimum Trace Width / Minimum Trace Spacing | 18μm(0.5oz) : 0.10mm/0.13mm (0.004"/0.006") |
300μm(8.6oz) : 0.60mm/0.60mm (0.024"/0.024") 400μm(11.4oz) : 0.70mm/0.70mm (0.028"/0.028") 500μm(14.3oz) : 0.80mm/0.80mm (0.032"/0.032") |
| Solder Mask Colors |
Green Blue Black White |
Green Blue |
| Silk Legend Colors |
White Yellow Black |
White Yellow Black |
| Outline Machining |
NC Router Press Cutting Machine |
NC Router |
| Maximum PCB size | 18μm - 70μm (0.5oz - 2oz): 481mm×481mm (18.9" x 18.9") |
105μm－210μm (3oz - 6oz): 475mm×470mm (18.7" x 18.5") 300μm－500μm (8.6oz - 14.3oz): 470 x 300mm (18.5" x 11.8") |
| Surface finish |
OSP (Water Soluble pre-flux) HASL (Hot Air Solder Leveler: lead free or eutectic) ENIG (Electroless Nickel Immersion Gold) Hard Gold |
OSP (Water Soluble pre-flux) HASL (Hot Air Solder Leveler: lead free or eutectic) ENIG (Electroless Nickel Immersion Gold) Hard Gold |
Please contact us for the specifications which you need but are not shown in the list.